Smaller camera designs help automakers add cameras without affecting
styling and reduce system cost
PHOENIX--(BUSINESS WIRE)--ON Semiconductor (Nasdaq: ON), driving energy efficient innovations,
continues to make major advances within the rapidly growing automotive
imaging sector with the announcement of two new highly integrated 1.0
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Megapixel (Mp) CMOS image sensing products. The new parts provide a
complete solution with the image sensor and processing functionality
integrated within a low power system-on-chip (SoC) that simplifies and
speeds adoption in applications such as rear and surround view cameras.
PCB real estate savings of greater than 30% can be achieved compared to
conventional solutions comprised of discrete sensor and processor
components. This helps designers to implement camera solutions without
impacting vehicle styling or aesthetics.
The number of cameras and other image sensing technologies utilized on
passenger vehicles continues to increase rapidly. Industry analyst
predictions suggest annual shipments of cameras for use in cars will
easily surpass 80 million units by 2020. Sensors that support the
progression towards full autonomous driving represent one area of
application, whilst imaging devices such as the AS0140
and AS0142
can be used to improve driver comfort, convenience and safety through a
growing range of Advanced Driver Assistance Systems (ADAS). Integrated
sensors can provide vehicle designers with easy-to-implement solutions
that support comprehensive and clear views of the vehicle surroundings
for drivers.
The AS0140 and AS0142 are both 1/4-inch format devices capable of
supporting 45 fps throughput at full resolution or 60 fps at 720p. Key
features include distortion correction, multi-color overlays and both
analog (NTSC) and digital (Ethernet) interfaces. Both SoC devices
achieve enhanced image quality by making use of the adaptive local tone
mapping (ALTM) in order to eliminate artifacts that impinge on the
acquisition process. Dynamic range of 93 decibels (dB) allows new
devices to operate effectively in both high and low light applications.
The AS0140 and AS0142 provide multi-camera synchronization support which
increases their value to automotive design engineers as the number of
cameras installed on vehicles continues to rise.
“These devices provide engineers with complete SoC camera solutions,
that combine low power operation and high dynamic range with minimal
impact in relation to PCB footprint and overall bill-of-materials cost,”
states Ross Jatou, Vice President and General Manager of the Automotive
Imaging Solutions Division at ON Semiconductor. “This means that they
are able to meet the imaging demands of car manufacturers from both a
logistical and performance perspective. Most current solutions still
rely on inefficient discrete arrangements with a separate image sensor
and image processor, or are SoCs with relatively limited functionality.”
Both new devices exhibit class-leading power efficiency; when running at
30 fps in high dynamic range (HDR) mode, they consume just 530
milliwatts (mW). Operating temperature range is -40°C to +105°C,
enhancing suitability for use in automotive environments. Engineering
samples are available now. The AS0140
will be in production in 4Q17, and AS0142
will be in production in 1Q18.
About ON Semiconductor
ON Semiconductor (Nasdaq: ON)
is driving energy efficient innovations, empowering customers to reduce
global energy use. The company is a leading supplier of
semiconductor-based solutions, offering a comprehensive portfolio of
energy efficient, power management, analog, sensors, logic, timing,
connectivity, discrete, SoC and custom devices. The company’s products
help engineers solve their unique design challenges in automotive,
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