High-speed 12 megapixel and 4k / UHD devices are first in compatible
family
PHOENIX--(BUSINESS WIRE)--ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has
announced its X-Class image sensor platform, which allows a single
camera design to support not only multiple product resolutions, but also
different pixel functionality. The first devices in the new platform are
the 12
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megapixel (MP) XGS 12000 and 4k
/ UHD resolution XGS 8000 image sensors, which provide
high-performance imaging capabilities for applications such as machine
vision, intelligent transportation systems and broadcast imaging.
The X-Class image sensor platform enables a new dimension in camera
design by supporting multiple CMOS pixel architectures within the same
image sensor frame. This allows a single camera design not only to
support multiple product resolutions, but also different pixel
functionality, such as larger pixels that trade resolution at a given
optical format for higher imaging sensitivity, designs optimized for low
noise operation to increase dynamic range and more. By supporting these
different pixel architectures through a common high bandwidth, low power
interface, camera manufacturers can leverage existing parts inventory
and accelerate time to market for new camera designs.
The initial devices in the X-Class family, the XGS 12000 and XGS 8000,
are based on the first pixel architecture to be deployed in this
platform – an advanced 3.2 µm global shutter CMOS pixel that features
superior imaging performance, high image uniformity and low noise. The
XGS 12000 provides 12 MP (4096 x 3072 pixel) resolution in a one-inch
optical format to supply the imaging detail and performance needed for
modern machine vision and inspection applications. The device is planned
to be available in two speed grades – one that fully utilizes 10GigE
interfaces by providing full resolution speeds up to 90 frames per
second (fps), and a lower price version providing 27 fps at full
resolution that aligns with the bandwidth available from USB 3.0
computer interfaces. The XGS 8000 provides 4k / UHD (4096 x 2160 pixels)
resolution in a 1/1.1 inch optical format and is also planned to be
available in two speed grades (130 and 75 fps), making the device ideal
for broadcast applications.
The package dimensions of both devices combine with a low thermal
profile enabled by the low-voltage, low-power architecture of the
X-Class interface to make them fully compatible with compact 29 x 29 mm2
camera designs.
“As the needs of industrial imaging applications such as machine vision
inspection and industrial automation continue to advance, the design and
performance of the image sensors targeting this growing market must
continue to evolve,” said Herb Erhardt, Vice President and General
Manager, Industrial Solutions Division, Image Sensor Group at ON
Semiconductor. “With the X-Class platform and devices based on the new
XGS pixel, end users have access to the performance and imaging
capabilities they need for these applications, while camera
manufacturers have the flexibility they require to develop
next-generation camera designs for their customers both today and in the
future.”
The XGS 12000
and XGS 8000
will begin sampling in the 2Q2018, with production availability
scheduled for the 3Q2018. Both devices will be available in 163-pin LGA
packages in monochrome and color configurations. Additional devices
based on the 3.2 µm XGS pixel, as well as products based on other pixel
architectures, are planned for the X-Class family in the future.
To help customers in the development of new camera designs incorporating
the new image sensors, ON Semiconductor offers evaluation kits that
support full device evaluation, including still image and video capture,
and region of interest readout. Other custom test functions can also be
configured. Customers can purchase an evaluation kit or enquire about an
on-site demonstration of X-Class devices by contacting their local ON
Semiconductor sales representative.
About ON Semiconductor
ON Semiconductor (Nasdaq: ON)
is driving energy efficient innovations, empowering customers to reduce
global energy use. The company is a leading supplier of
semiconductor-based solutions, offering a comprehensive portfolio of
energy efficient, power management, analog, sensors, logic, timing,
connectivity, discrete, SoC and custom devices. The company’s products
help engineers solve their unique design challenges in automotive,
communications, computing, consumer, industrial, medical, aerospace and
defense applications. ON Semiconductor operates a responsive,
reliable, world-class supply chain and quality program, a robust
compliance and ethics program, and a network of manufacturing
facilities, sales offices and design centers in key markets throughout
North America, Europe and the Asia Pacific regions. For more
information, visit http://www.onsemi.com.
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trademarks of Semiconductor Components Industries, LLC. All other brand
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or trademarks of their respective holders. Although the company
references its website in this news release, information on the website
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Contacts
ON Semiconductor
Veronika Holscher, 408-660-2688
Corporate
Public Relations
or
Parag
Agarwal, 602-244-3437
Vice President Investor Relations and
Corporate Development