Wins a Best Paper Award from IWLPC 2017
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film processing
systems, today announced its participation in the 14th International
Conference and Exhibition on Device Packaging (IMAPS DPC 2018). The
company will present its technical paper on “Linear Transport Degas,
Pre-Clean, and PVD Processes for RDL Barrier/Seed Formation in Fan-Out
Packaging,” at 4:30pm Wednesday afternoon, March 7th, 2018, at the
People are also reading…
WekoPa Resort in Fountain Hills, Arizona.
Intevac is also pleased to announce recognition by the IWLPC Technical
Committee regarding Best Presentation & Papers Awards for IWLPC 2017,
based on the combination of technical merit, relevance, originality,
knowledge of subject, quality of material, and quality of presentation.
Intevac received the Best of Advanced Manufacturing and Test Track Paper
Award for its paper on “Process and Productivity Results from a
Carrier-Based Linear Transport PVD Systems for RDL Seed Layer Deposition
in Fan-Out Packaging Applications.”
For more information visit www.chipscalereview.com/news1801.html#1801-01.
Semiconductor device packaging technology in general, and fan-out
wafer-level packaging (FOWLP) / fan-out panel-level packaging (FOPLP)
technology in particular, is being driven by the strong cost advantages
these advanced packaging technologies offer over the expense of
implementing continued Moore's Law progress for sub-10nm semiconductor
IC process nodes. Fan-out packaging provides for increased I/O
(Input/Output) density for a given semiconductor device while
simultaneously supporting smaller packaged die sizes, thereby reducing
the amount of space integrated circuit content occupies in handheld
consumer electronic products, such as smartphones, wearables, and
Internet of Things (IoT) devices.
The INTEVAC MATRIX® is a high-productivity, substrate-independent
thin-film processing platform that is well-positioned for multiple
fan-out packaging applications. The MATRIX Physical Vapor Deposition
(PVD) system offers a much-reduced cost of ownership (COO) over the
current PVD process tools being used for Redistribution Layer (RDL)
barrier/seed layer applications, and also offers the flexibility to run
multiple substrates on the same system, from 300mm wafer-level (round)
substrates to panel-level (square or rectangular) substrates, which
today are up to 680mm on a side.
About IMAPS DPC 2018
The 14th Annual Device Packaging Conference (DPC 2018) will be held in
Fountain Hills, Arizona, on March 5-8, 2018. It is an international
event organized by the International Microelectronics Assembly and
Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and
provides numerous technical, social and networking opportunities for
meeting leading experts in these fields. The conference will attract a
diverse group of people within industry and academia. It provides a
chance for educational interactions across many different functional
groups and experience levels. People who will benefit from this
conference include: scientists, process engineers, product engineers,
manufacturing engineers, professors, students, business managers, and
sales & marketing professionals.
For more information visit www.imaps.org/devicepackaging/.
About IWLPC
IWLPC brings together the semiconductor industry's most respected
authorities addressing all aspects of wafer-level, 3D, TSV and
integrated system packaging.
Going into its 15th year, the IWLPC is co-produced by Chip Scale Review,
the leading international magazine addressing the semiconductor
packaging industry, and SMTA, the distinguished global association
representing electronic assembly and manufacturing professionals.
The conference comprises three parallel technical tracks with two full
days of presentations on wafer-level packaging, 3D integration, and
advanced manufacturing and test. Professional development courses,
keynote speakers, and panel discussions are offered by world-class
experts and enable attendees to broaden their technical knowledge. The
technical program includes a two-day expo where 60+ exhibitors showcase
their latest technologies and products. The conference provides a
collective network of over 800 industry professionals, including vendors
from leading semiconductor companies, foundries, and OSATS, as well as
key technology, equipment, and materials suppliers in the exhibit area.
Attendees will be inspired by the quantity and quality of the featured
new developments and emerging technologies. The 15th Annual Conference
will be held October 23-25, 2018 in San Jose, CA.
For more information visit: www.iwlpc.com.
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film Equipment
and Photonics.
In our Thin-film Equipment business, we are a leader in the design and
development of high-productivity, thin-film processing systems. Our
production-proven platforms are designed for high-volume manufacturing
of substrates with precise thin film properties, such as the hard drive
media, display cover panel, and solar photovoltaic markets we serve
currently.
In our Photonics business, we are a recognized leading developer of
advanced high-sensitivity digital sensors, cameras and systems that
primarily serve the defense industry. We are the provider of integrated
digital imaging systems for most U.S. military night vision programs.
For more information call 408-986-9888, or visit the Company's website
at www.intevac.com.
Contacts
Intevac, Inc.
Christopher Smith, 408-986-9888
Vice President,
New Business Development
or
Claire McAdams, 530-265-9899
Investor
Relations